LS-HDPRO
ULTRA COMPACT ALL-IN-ONE LASER MICROMACHINING SYSTEM
LS-HDPRO Versatile ultra-compact all-in-one laser micromachining system ready for nanosecond or femtosecond laser processing where nanometer resolutions and laser spot sizes down to 1 micron are required. The laser head integrates external power control, 2D galvanometer scanning, high quality vision system, autofocus laser sensor and all the electronics necessary to drive up to 4 high performance stages (XYZ-Rot).
Typical Specifications
| Working Area | 100 mm x 100 mm x 25 mm |
| Resolution | Down to 20 nm (XY), 0.1 μm (Z) |
| Repeatability | ± 0.3 μm (XY); ± 0.1 μm (Z) |
| Accuracy | ± 2.5 μm (XY); ± 1 μm (Z) |
| Available Laser Sources | Green-UV ns or IR fs laser |
| Substrate Holder | Custom |
| Minimum Laser Spot Size | Down to 1 μm |
| External Dimensions | 450 x 750 x 1000 mm (W x D x H) |
| Weight | Aprox. 120 Kg |
| Control Unit | Integrated PC with 27″ monitor |
Features
Fixed optic head with automatic objective´s change.
Co-lineal vision system with motorized optics.
Co-lineal surface measurement laser system with close-loop correction or 2D scanning option.
Automated camera calibration.
Automated feature camera recognition for precision aligment and rotation compensation.
Based on CAD GUI enviroment (Import DXF, DWG, DWT, ACIS… files).
Class 1 high end enclosure.
Applications
Solar Cell Processing
Wafer scribing and dicing
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